Solid-state reactions of SiC/W-25Re alloy and thermal stability of SiC/Ti/W-25Re alloy under high temperature annealing
SCIE
SCOPUS
- Title
- Solid-state reactions of SiC/W-25Re alloy and thermal stability of SiC/Ti/W-25Re alloy under high temperature annealing
- Authors
- Han, JS; Jang, SS; Park, DY; Oh, YJ; Park, SJ
- Date Issued
- 2016-09
- Publisher
- John Wiley & Sons, Inc.
- Abstract
- Solid-state reactions of SiC/W-25Re alloy and SiC/Ti/W-25Re alloy are investigated under the high-temperature annealing at 1500 degrees C. The interface reaction layer between SiC and W-25Re alloy is composed of WC-WSi2-W5Si3-W-Re sigma phase-dendrite microstructure. Solid-state reactions between W and SiC form two types of W-silicides and the relative depletion of W brings formation of the W-Re sigma phase. In order to prevent direct interfacial reactions, Ti layer is intercalated as a secondary buffer layer. Compared to the original interface, thicknesses of both reaction layer and dendrite layer are significantly decreased. Although the thermal reaction of Ti and W brings inhomogeneous characteristics, the proposed functionally graded structure is expected to enhance the thermal stability.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/36524
- DOI
- 10.1002/ADEM.201500660
- ISSN
- 1438-1656
- Article Type
- Article
- Citation
- Advanced Engineering Materials, vol. 18, no. 9, page. 1574 - 1580, 2016-09
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- There are no files associated with this item.
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