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Requirements for Forming Efficient 3‑D Charge Transport Pathway in Diketopyrrolopyrrole-Based Copolymers: Film Morphology vs Molecular Packing SCIE SCOPUS

Title
Requirements for Forming Efficient 3‑D Charge Transport Pathway in Diketopyrrolopyrrole-Based Copolymers: Film Morphology vs Molecular Packing
Authors
Gang-Young LeeA-Reum HanTaewan KimHae Rang LeeJoon Hak OhPark, T.
Date Issued
2016-05-18
Publisher
AMERICAN CHEMICAL SOCIETY
Abstract
To achieve extremely high planarity and processability simultaneously, we have newly designed and synthesized copolymers composed of donor units of 2,2'-(2,5-dialkoxy-1,4-phenylene)dithieno[3,2-b]thiophene (TT-P-TT) and acceptor units of diketopyrrolopyrrole (DPP). These copolymers consist of a highly planar backbone due to intramolecular interactions. We have systematically investigated the effects of intermolecular interactions by controlling the side chain bulkiness on the polymer thin-film morphologies, packing structures, and charge transport. The thin-film microstructures of the copolymers are found to be critically dependent upon subtle changes in the intermolecular interactions, and :charge transport dynamics of the copolymer based field-effect transistors (FETs) has been investigated by in-depth structure property relationship study. Although the size of the fibrillar structures increases as the bulkiness of the side chains in the copolymer increases, the copolymer with the smallest side chain shows remarkably high charge carrier mobility. Our findings reveal the requirement for forming efficient 3-D charge transport pathway and highlight the importance of the molecular packing and interdomain connectivity, rather than the crystalline domain size. The results obtained herein demonstrate the importance of tailoring the side chain bulkiness and provide new insights into the molecular design for high performance polymer semiconductors.
URI
https://oasis.postech.ac.kr/handle/2014.oak/36663
DOI
10.1021/ACSAMI.6B00595
ISSN
1944-8244
Article Type
Article
Citation
ACS APPLIED MATERIALS & INTERFACES, vol. 8, no. 19, page. 12307 - 12315, 2016-05-18
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