DC Field | Value | Language |
---|---|---|
dc.contributor.author | Sun Ig Hong | - |
dc.contributor.author | Jongun Moon | - |
dc.contributor.author | Soon Ku Hong | - |
dc.contributor.author | Kim, H.S. | - |
dc.date.accessioned | 2017-07-19T13:35:20Z | - |
dc.date.available | 2017-07-19T13:35:20Z | - |
dc.date.created | 2017-02-16 | - |
dc.date.issued | 2017-01 | - |
dc.identifier.issn | 0921-5093 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/37266 | - |
dc.description.abstract | The nature of obstacles to dislocation motion in CoCrFeMnNi alloy was analyzed using the thermally activated deformation analyses at low temperatures. The strong temperature dependence of yield stress and small activation volume in CoCrFeMnNi favor the dislocation glide over the obstacles with high friction stress. The activation volume of CoCrFeMnNi alloy (10-100 b(3)) in this study is much smaller than those of conventional FCC metals (10(2)similar to 10(3) b(3)), but close to those observed in BCC metals (8-100 b(3)) and HCP metals (5-100 b(3)). The increase of the activation volume with strain supports overcoming the nanoscale inhomogeneity such as co-clusters and/or short range orders as the rate controlling mechanism. The transition of dislocation structure from planar array to cell structure at 20% strain in CoCrFeMnNi reported in the literature can be attributed to the prevalent shearing of nanoscale inhomogeneity with strain. | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCIENCE SA | - |
dc.relation.isPartOf | Materials Science and Engineering: A | - |
dc.title | Thermally activated deformation and the rate controlling mechanism in CoCrFeMnNi high entropy alloy | - |
dc.type | Article | - |
dc.identifier.doi | 10.1016/J.MSEA.2016.11.078 | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | Materials Science and Engineering: A, v.682, pp.569 - 576 | - |
dc.identifier.wosid | 000393003800065 | - |
dc.date.tcdate | 2018-11-01 | - |
dc.citation.endPage | 576 | - |
dc.citation.startPage | 569 | - |
dc.citation.title | Materials Science and Engineering: A | - |
dc.citation.volume | 682 | - |
dc.contributor.affiliatedAuthor | Kim, H.S. | - |
dc.identifier.scopusid | 2-s2.0-84998656227 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 16 | - |
dc.description.scptc | 16 | * |
dc.date.scptcdate | 2018-05-121 | * |
dc.type.docType | Article | - |
dc.subject.keywordPlus | CU-MG ALLOYS | - |
dc.subject.keywordPlus | SOLID-SOLUTION | - |
dc.subject.keywordPlus | INTERMEDIATE TEMPERATURES | - |
dc.subject.keywordPlus | PLASTIC-DEFORMATION | - |
dc.subject.keywordPlus | TENSILE PROPERTIES | - |
dc.subject.keywordPlus | RATE SENSITIVITY | - |
dc.subject.keywordPlus | SINGLE-PHASE | - |
dc.subject.keywordPlus | STRAIN-RATE | - |
dc.subject.keywordPlus | AL | - |
dc.subject.keywordPlus | MICROSTRUCTURE | - |
dc.subject.keywordAuthor | Thermally activated processes | - |
dc.subject.keywordAuthor | Mechanical properties | - |
dc.subject.keywordAuthor | Dislocation | - |
dc.subject.keywordAuthor | High entropy alloy | - |
dc.subject.keywordAuthor | Activation volume | - |
dc.relation.journalWebOfScienceCategory | Nanoscience & Nanotechnology | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.relation.journalWebOfScienceCategory | Metallurgy & Metallurgical Engineering | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalResearchArea | Materials Science | - |
dc.relation.journalResearchArea | Metallurgy & Metallurgical Engineering | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
library@postech.ac.kr Tel: 054-279-2548
Copyrights © by 2017 Pohang University of Science ad Technology All right reserved.