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Continuum understanding of twin formation near grain boundaries of FCC metals with low stacking fault energy SCIE SCOPUS

Title
Continuum understanding of twin formation near grain boundaries of FCC metals with low stacking fault energy
Authors
Jaimyun JungJae Ik YoonJung Gi KimMarat I. LatypovJin You KimHyoung Seop Kim
Date Issued
2017-05
Publisher
Nature Publishing Group | Shanghai Institute of Ceramics of the Chinese Academy of Sciences (SICCAS)
Abstract
Deformation twinning from grain boundaries is often observed in face-centered cubic metals with low stacking fault energy. One of the possible factors that contribute to twinning origination from grain boundaries is the intergranular interactions during deformation. Nonetheless, the influence of mechanical interaction among grains on twin evolution has not been fully understood. In spite of extensive experimental and modeling efforts on correlating microstructural features with their twinning behavior, a clear relation among the large aggregate of grains is still lacking. In this work, we characterize the micromechanics of grain-to-grain interactions that contribute to twin evolution by investigating the mechanical twins near grain boundaries using a full-field crystal plasticity simulation of a twinning-induced plasticity steel deformed in uniaxial tension at room temperature. Microstructures are first observed through electron backscatter diffraction technique to obtain data to reconstruct a statistically equivalent microstructure through synthetic microstructure building. Grain-to-grain micromechanical response is analyzed to assess the collective twinning behavior of the microstructural volume element under tensile deformation. Examination of the simulated results reveal that grain interactions are capable of changing the local mechanical behavior near grain boundaries by transferring strain across grain boundary or localizing strain near grain boundary.
URI
https://oasis.postech.ac.kr/handle/2014.oak/39127
DOI
10.1038/S41524-017-0023-1
ISSN
2057-3960
Article Type
Article
Citation
npj Computational Materials, vol. 3, 2017-05
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김형섭KIM, HYOUNG SEOP
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