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dc.contributor.authorLEE Y. S.-
dc.contributor.authorKIM K. T.-
dc.date.accessioned2018-01-08T11:00:26Z-
dc.date.available2018-01-08T11:00:26Z-
dc.date.created2009-03-26-
dc.date.issued1992-04-
dc.identifier.issn0022-0817-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/40020-
dc.languageEnglish-
dc.publisherAMERICAN SOCIETY OF MECHANICAL ENGINE-
dc.relation.isPartOfJOURNAL OF ENGINEERING FOR INDUSTRY -
dc.titleAN ANALYSIS OF VOID DEFORMATION CAUSED BY POWER LAW CREEP AND DIFFUSION ENHANCED BY MECHANICAL STRESS IN HIP PROCESS-
dc.typeArticle-
dc.type.rimsART-
dc.identifier.bibliographicCitationJOURNAL OF ENGINEERING FOR INDUSTRY , v.114, no.3, pp.277 - 283-
dc.citation.endPage283-
dc.citation.number3-
dc.citation.startPage277-
dc.citation.titleJOURNAL OF ENGINEERING FOR INDUSTRY -
dc.citation.volume114-
dc.contributor.affiliatedAuthorKIM K. T.-
dc.description.journalClass1-
dc.description.journalClass1-

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