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A Novel Solution-Stamping Process for Preparation of a Highly Conductive Aluminum Thin Film SCIE SCOPUS
- Title
- A Novel Solution-Stamping Process for Preparation of a Highly Conductive Aluminum Thin Film
- Authors
- CHOI, SI YOUNG; Hye Moon Lee; Kyung Tae Kim; Jung-Yeul Yun; Dae Soo Jung; Seung Bin Park; Jongwook Park
- Date Issued
- 2011-12-08
- Publisher
- WILEY-V C H VERLAG GMBH
- Abstract
- A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.
- Keywords
- aluminum ink; solution processes; thin films; conductive features; electrodes
- ISSN
- 0935-9648
- Article Type
- Article
- Citation
- ADVANCED MATERIALS, vol. 23, no. 46, page. 5524 - +, 2011-12-08
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