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Department of Mechanical Engineering (기계공학과)
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Article
Numerical Simulation of Hot Embossing Filling Stage using a Viscoelastic Constitutive Model
SCIE
SCOPUS
KCI
KOREA-AUSTRALIA RHEOLOGY JOURNAL, vol. 23, no. 3, page. 139 - 146, 2011-09
Park, JM
;
Kang, TG
;
Park, SJ
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FABRICATION
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FLOW
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hot embossing
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MICROSTRUCTURES
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OPTIMIZATION
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squeezing flow
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viscoelasticity
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