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TWIP강 기반 3층 복층강판에서의 계면강화 효과
- Title
- TWIP강 기반 3층 복층강판에서의 계면강화 효과
- Authors
- LEE, SUNG HAK; 김정기; 박형근; 이학현; 설재복; CHIN, KWANG GEUN; 김형섭
- Date Issued
- 2017-11-17
- Publisher
- 대한금속재료학회
- Article Type
- Conference
- Citation
- 제 31회 첨단구조재료 심포지엄, 2017-11-17
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Related Researcher
- 이성학LEE, SUNG HAK
- Dept of Materials Science & Enginrg