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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 박현철 | - |
| dc.contributor.author | 우태욱 | - |
| dc.contributor.author | Masao Sakane | - |
| dc.contributor.author | Kaoru Kobayashi | - |
| dc.date.accessioned | 2018-05-22T14:39:39Z | - |
| dc.date.available | 2018-05-22T14:39:39Z | - |
| dc.date.created | 2010-01-08 | - |
| dc.date.issued | 2009-11-15 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/43596 | - |
| dc.publisher | JSME | - |
| dc.relation.isPartOf | Asian Pacific Conference for Materials and Mechanics 2009 | - |
| dc.relation.isPartOf | ASIAN PACIFIC CONFERENCE FOR MATERIALS AND MECHANICS 2009 | - |
| dc.title | Creep-fatigue crack propagation behavior of Sn-3.0ag-0.5cu lead-free solder | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.identifier.bibliographicCitation | Asian Pacific Conference for Materials and Mechanics 2009 | - |
| dc.citation.conferencePlace | JA | - |
| dc.citation.title | Asian Pacific Conference for Materials and Mechanics 2009 | - |
| dc.contributor.affiliatedAuthor | 박현철 | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalClass | 1 | - |
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