Effect of Cu doping on thermal stability improvement of silver metallization
- Title
- Effect of Cu doping on thermal stability improvement of silver metallization
- Authors
- 이종람
- Date Issued
- 2008-03-24
- Publisher
- MRS
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/43995
- Article Type
- Conference
- Citation
- Materials Research Society Spring meeting, 2008-03-24
- Files in This Item:
- There are no files associated with this item.
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