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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 이승구 | - |
| dc.contributor.author | 유승주 | - |
| dc.contributor.author | 김동기 | - |
| dc.contributor.author | J. Ahn | - |
| dc.contributor.author | H. Jung | - |
| dc.date.accessioned | 2018-06-17T10:03:42Z | - |
| dc.date.available | 2018-06-17T10:03:42Z | - |
| dc.date.created | 2011-03-22 | - |
| dc.date.issued | 2011-03-14 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/57064 | - |
| dc.publisher | European Design and Automation Association | - |
| dc.relation.isPartOf | Design, Automation and Test in Europe | - |
| dc.relation.isPartOf | PROC. DATE | - |
| dc.title | A Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded SoC | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.identifier.bibliographicCitation | Design, Automation and Test in Europe | - |
| dc.citation.conferenceDate | 2011-03-14 | - |
| dc.citation.conferencePlace | FR | - |
| dc.citation.title | Design, Automation and Test in Europe | - |
| dc.contributor.affiliatedAuthor | 이승구 | - |
| dc.contributor.affiliatedAuthor | 유승주 | - |
| dc.contributor.affiliatedAuthor | 김동기 | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalClass | 1 | - |
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Related Researcher
- 유승주YOO, SUNGJOO
- Dept of Electrical Enginrg