A Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded Systems
- Title
- A Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded Systems
- Authors
- 유승주; 김동기; 이승구; 안정호; 정현욱
- Date Issued
- 2011-03-10
- Publisher
- IEEE
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/57398
- Article Type
- Conference
- Citation
- Design Automation and Test in Europe, 2011-03-10
- Files in This Item:
- There are no files associated with this item.
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