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dc.contributor.author김영수en_US
dc.date.accessioned2015-02-24T15:02:44Z-
dc.date.available2015-02-24T15:02:44Z-
dc.date.issued2001en_US
dc.identifier.otherOAK-2015-03377en_US
dc.identifier.urihttp://postech.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000001905529en_US
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/5757-
dc.descriptionMasteren_US
dc.languagekoren_US
dc.publisher포항공과대학교en_US
dc.rightsBY_NC_NDen_US
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/2.0/kren_US
dc.titlePoly (vinylidene Fluoride) 고분자 결착재와 Copper Plate사이의 계면 접착 메카니즘에 대한 연구en_US
dc.title.alternativeInterfacial Adhesion Mechanism between Poly(vinylidene fluoride) Binder and Copper Electroplate for Lithium Ion Secondary Batteriesen_US
dc.typeThesisen_US
dc.contributor.college일반대학원 전자컴퓨터공학부en_US
dc.date.degree2001-02en_US
dc.type.docTypeThesis-

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