Development of HA-PLGA Scaffold Encapsulating Intact BMP-2 using Solid Freeform Fabrication Technology
- Title
- Development of HA-PLGA Scaffold Encapsulating Intact BMP-2 using Solid Freeform Fabrication Technology
- Authors
- 조동우
- Date Issued
- 2011-06-13
- Publisher
- ASME
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/58901
- Article Type
- Conference
- Citation
- 2011 ASME International Manufacturing Science and Engineering Conference (MSEC), 2011-06-13
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.