Molecular Dynamics Simulation of the Tensile Test for Tungsten-Copper Alloy
- Title
- Molecular Dynamics Simulation of the Tensile Test for Tungsten-Copper Alloy
- Authors
- 박성진
- Date Issued
- 2013-11-01
- Publisher
- KOREAN POWDER METALLURGY INSTITUTE
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/64664
- Article Type
- Conference
- Citation
- 2013 FALL CONFERENCE OF KOREAN POWDER METALLURGY INSTITUTE, 2013-11-01
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.