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Full-speed USB 2.0 device 용 Link 및 Application layer 칩
- Title
- Full-speed USB 2.0 device 용 Link 및 Application layer 칩
- Date Issued
- 2013-11-23
- Publisher
- 대한전자공학회
- Article Type
- Conference
- Citation
- 대한전자공학회 추계학술대회, page. 43 - 46, 2013-11-23
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Related Researcher
- 김병섭KIM, BYUNGSUB
- Dept of Electrical Enginrg