Full-speed USB 2.0 device 용 Link 및 Application layer 칩
- Title
- Full-speed USB 2.0 device 용 Link 및 Application layer 칩
- Authors
- 심재윤; 신기범; 성기환; 김병섭; 박홍준
- Date Issued
- 2013-11-23
- Publisher
- 대한전자공학회
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/65790
- Article Type
- Conference
- Citation
- 대한전자공학회 추계학술대회, page. 43 - 46, 2013-11-23
- Files in This Item:
- There are no files associated with this item.
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