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Molecular Dynamics Simulation of Deformation Behavior of Tungsten-Copper Alloy under High Strain Rate and High Temperature

Title
Molecular Dynamics Simulation of Deformation Behavior of Tungsten-Copper Alloy under High Strain Rate and High Temperature
Authors
박성진
Date Issued
2016-09-22
Publisher
30th conference on Advanced Structural Materials
URI
https://oasis.postech.ac.kr/handle/2014.oak/72223
Article Type
Conference
Citation
KIM, 2016-09-22
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박성진PARK, SEONG JIN
Dept of Mechanical Enginrg
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