Molecular Dynamics Simulation of Deformation Behavior of Tungsten-Copper Alloy under High Strain Rate and High Temperature
- Title
- Molecular Dynamics Simulation of Deformation Behavior of Tungsten-Copper Alloy under High Strain Rate and High Temperature
- Authors
- 박성진
- Date Issued
- 2016-09-22
- Publisher
- 30th conference on Advanced Structural Materials
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/72223
- Article Type
- Conference
- Citation
- KIM, 2016-09-22
- Files in This Item:
- There are no files associated with this item.
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