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The Application of plasma for metal atomic layer deposition (ALD) for Cu Interconnect Technology
- Title
- The Application of plasma for metal atomic layer deposition (ALD) for Cu Interconnect Technology
- Authors
- 김형준
- Date Issued
- 2003-11-01
- Article Type
- Conference
- Citation
- American Vacuum Society, 2003-11-01
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Related Researcher
- 김형준KIM, HYUNGJUN
- Dept of Materials Science & Enginrg