The Application of plasma for metal atomic layer deposition (ALD) for Cu Interconnect Technology
- Title
- The Application of plasma for metal atomic layer deposition (ALD) for Cu Interconnect Technology
- Authors
- 김형준
- Date Issued
- 2003-05-01
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/73993
- Article Type
- Conference
- Citation
- Semiconductor Fabtech, 2003-05-01
- Files in This Item:
- There are no files associated with this item.
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