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(hfac)Cu(Ⅰ)(DMB)와 Isopropanol(IPA)/H2를 이용한 Cu 저온 증착
- Title
- (hfac)Cu(Ⅰ)(DMB)와 Isopropanol(IPA)/H2를 이용한 Cu 저온 증착
- Authors
- 용기중
- Date Issued
- 2002-11-01
- Article Type
- Conference
- Citation
- 2002년도 한국재료학회 추계학술발표대회, 2002-11-01
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Related Researcher
- 용기중YONG, KIJUNG
- Dept. of Chemical Enginrg