Residual Stress and Thermal Expansion Behaviors in Dielectric Thin Films Prepared from Polyalkylsilsesquioxane Spin-On Glass Materials
- Title
- Residual Stress and Thermal Expansion Behaviors in Dielectric Thin Films Prepared from Polyalkylsilsesquioxane Spin-On Glass Materials
- Authors
- 이문호
- Date Issued
- 2001-04-01
- Publisher
- MRS-Spring Meeting, MRS, Convention Center, San Francisco, USA
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/75894
- Article Type
- Conference
- Citation
- MRS-Spring Meeting, page. 103 - 103, 2001-04-01
- Files in This Item:
- There are no files associated with this item.
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