Thesis
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Body-Tied Rectangular Channel Triple Gate FinFET 공정조건 최적화와 Simulation 결과 Using TMAH Wet Etching(Bulk Si Wafer)
- Title
- Body-Tied Rectangular Channel Triple Gate FinFET 공정조건 최적화와 Simulation 결과 Using TMAH Wet Etching(Bulk Si Wafer)
- Authors
- 박상수
- Date Issued
- 2006
- Publisher
- 포항공과대학교
- URI
- http://postech.dcollection.net/jsp/common/DcLoOrgPer.jsp?sItemId=000001907531
https://oasis.postech.ac.kr/handle/2014.oak/7749
- Article Type
- Thesis
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.