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Halide and metal organic based plasma-enhanced ALD of TaNx for Cu interconnect technology
- Title
- Halide and metal organic based plasma-enhanced ALD of TaNx for Cu interconnect technology
- Authors
- 김형준
- Date Issued
- 2003-08-01
- Article Type
- Conference
- Citation
- American Vacuum Society, 2003-08-01
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Related Researcher
- 김형준KIM, HYUNGJUN
- Dept of Materials Science & Enginrg