Conference
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 임근배 | - |
| dc.date.accessioned | 2018-06-21T10:58:45Z | - |
| dc.date.available | 2018-06-21T10:58:45Z | - |
| dc.date.created | 2009-03-27 | - |
| dc.date.issued | 1997-11-19 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/80038 | - |
| dc.publisher | The Institute of Electrical Engineers | - |
| dc.relation.isPartOf | Proceeding of The Institute of Electrical Engineers of Japan | - |
| dc.relation.isPartOf | Proceeding of The Institute of Electrical Engineers | - |
| dc.title | A New Bulk-Micromachining Process using Deep RIE and Wet Etching | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.identifier.bibliographicCitation | Proceeding of The Institute of Electrical Engineers of Japan, pp.59 - 62 | - |
| dc.citation.conferencePlace | JA | - |
| dc.citation.endPage | 62 | - |
| dc.citation.startPage | 59 | - |
| dc.citation.title | Proceeding of The Institute of Electrical Engineers of Japan | - |
| dc.contributor.affiliatedAuthor | 임근배 | - |
| dc.description.journalClass | 1 | - |
| dc.description.journalClass | 1 | - |
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Related Researcher
- 임근배LIM, GEUN BAE
- Dept of Mechanical Enginrg