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Effect of physical and mechanical properties of epoxy resins on adhesion behavior of epoxy/copper leadframe joints

Title
Effect of physical and mechanical properties of epoxy resins on adhesion behavior of epoxy/copper leadframe joints
Authors
조길원
Date Issued
2000-01-01
URI
https://oasis.postech.ac.kr/handle/2014.oak/81261
Article Type
Conference
Citation
한국고분자학회 연구논문, page. 178, 2000-01-01
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조길원CHO, KIL WON
Dept. of Chemical Enginrg
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