Impact of Line Mismatch on Two-Wire Deembedding Methods in Early Characterization of Emerging Interconnects

Abstract

In this paper, we analyze the impact of line mismatch on two-wire deembedding methods in early characterization of emerging interconnects. According to our analysis, mismatch of wires significantly reduces the accuracy of deembedding methods using two test wire structures and causes unexpectedly large error. Therefore, characterizing emerging interconnects with the deembedding methods is not reliable in an early development period when the process variation is large. To help engineers to decide whether the deembedding methods are applicable or not, we theoretically and empirically analyze how line mismatch affects the deembedding accuracy, and derive a condition under which the deembedding methods are reliable.