Impact of Grain Sizes on Programmable Memory Characteristics in Two-Dimensional Organic-Inorganic Hybrid Perovskite Memory
SCIE
SCOPUS
- Title
- Impact of Grain Sizes on Programmable Memory Characteristics in Two-Dimensional Organic-Inorganic Hybrid Perovskite Memory
- Authors
- 이동우; BOHEE, HWANG; LEE, JANG SIK
- Date Issued
- 2019-06
- Publisher
- AMER CHEMICAL SOC
- Abstract
- Recently, organic-inorganic hybrid perovskites (OIHPs) have been used in resistive switching memory applications because of current-voltage hysteresis that originated from ion migration in the perovskite film. As the density of the memory devices continues to increase, the size of the devices approaches that of the individual grains of the polycrystalline films. Thus, the effects of the grain boundary and the grain size will become important to investigate the influence on the switching behaviors. Here, we report the effects of grain sizes on the resistive switching property of (C4H9NH3)(2)PbBr4 (BA(2)PbBr(4)) films. The BA(2)PbBr(4) films were formed by using sequential vapor deposition. First, a lead bromide (PbBr2) film was deposited by thermal evaporation, and then the film was exposed to organic vapor to form BA(2)PbBr(4) films. The grain sizes were controlled by changing the transformation temperatures (T-T = 100, 150, and 200 degrees C). When the TT values were 100, 150, and 200 degrees C, the grain sizes of BA(2)PbBr(4) were similar to 180 nm, similar to 1, and similar to 30 mu m, respectively. In the memory device based on BA(2)PbBr(4), the off current decreased from similar to 10(-4) to similar to 10(-8) A as the grain size increased from similar to 180 nm to similar to 30 mu m. This method to synthesize BA(2)PbBr(4) films provides a simple way to control the grain sizes, and understanding of the effects of grain sizes on memory characteristics will provide an insight to improve the reliability of the OIHP-based memory as the electronic devices are scaled down to the sizes of grains.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/99116
- DOI
- 10.1021/acsami.9b05038
- ISSN
- 1944-8244
- Article Type
- Article
- Citation
- ACS APPLIED MATERIALS & INTERFACES, vol. 11, no. 22, page. 20225 - 20231, 2019-06
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