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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Thesis

A Study on Three-Dimensional Integration With Through-Silicon Via

Thesis(Doctor), 2019

김태희

Conference

An Experimental Verification of A Scaled RC-dominant Interconnect Line Model of High-speed Wireline

한국반도체학술대회, 2014-02-26

Article

Impact of Line Mismatch on Two-Wire Deembedding Methods in Early Characterization of Emerging InterconnectsSCIESCOPUS

IEEE Transactions on Components Packaging and Manufacturing Technology, vol. 9, no. 5, page. 905 - 912, 2019-05

1

OAK

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