Open Access System for Information Sharing

Login Library
검색

  OASIS Repository@POSTECHLIBRARY

Browsing by  AuthorYun, HK

전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하
All 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
or enter first few letters:
Showing results 1 to 5 of 5
Article
Adhesion improvement of epoxy resin copper lead frame joints by azole compoundsSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 12, no. 5, page. 541 - 561, 1998-01

Article
Adhesion improvement of epoxy resin to alloy 42 lead frame by silane coupling agentsSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 11, no. 6, page. 797 - 809, 1997-01

Article
Adhesion improvement of epoxy resin/polyimide joints by amine treatment of polyimide surfaceSCIESCOPUS

POLYMER, vol. 38, no. 4, page. 827 - 834, 1997-02

Article
Effects of plasma treatment of polyimide on the adhesion strength of epoxy resin/polyimide jointsSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 11, no. 1, page. 95 - 104, 1997-01

Article
Synthesis and characterization of water-soluble polymeric adhesion promoter for epoxy resin/copper jointsSCIESCOPUS

JOURNAL OF APPLIED POLYMER SCIENCE, vol. 85, no. 10, page. 2202 - 2210, 2002-09-06

1
개인정보처리방침 Personal Information Protection Policy

library@postech.ac.kr Tel: 054-279-2548

Copyrights © by 2017 Pohang University of Science ad Technology All right reserved.

Browse

Login Library Help