Adhesion improvement of epoxy resin copper lead frame joints by azole compounds
SCIE
SCOPUS
- Title
- Adhesion improvement of epoxy resin copper lead frame joints by azole compounds
- Authors
- Song, SM; Park, CE; Yun, HK; Hwang, CS; Oh, SY; Park, JM
- Date Issued
- 1998-01
- Publisher
- VSP BV
- Abstract
- The adhesion strength of epoxy resin/copper joints is often very poor, due to the naturally formed copper oxide having a low mechanical strength. To improve the adhesion strength of epoxy resin/copper lead frame joints, copper lead frames were created with azole compounds as adhesion promoters. The azole compounds used were benzotriazole (BTA), benzotriazole-5-carboxylic acid (CBTA), 8-azaadenine, imidazole, 2-methyl imidazole, urocanic acid, adenine, benzimidazole, and polybenzimidazole (PBI). The dependence of the adhesion strength of epoxy resin/azole-treated copper joints on the structure of the azole compound. the azole treatment time, and the azole treatment temperature was investigated. The surface coverage of azole-treated copper was examined by contact angle measurements, a surface defect test, optical microscopy, and scanning electron microscopy (SEM), and the locus of failure was studied by X-ray photoelectron spectroscopy (XPS). Triazole compounds such as CBTA and 8-azaadenine showed excellent adhesion strength; imidazole-based azole compounds did not improve the adhesion strength. However, the adhesion strength of CBTA- and 8-azaadenine-treated joints decreased with increasing treatment time, since thick porous Cu-azole complexes had a weaker mechanical strength when formed. The polymeric azole compound PBI showed the highest adhesion strength, 785 N/m, because of complete coverage of the copper surface. The thermal stability of azole compounds and epoxy resin/azole-treated copper joints was also investigated. CBTA and 8-azaadenine did not decompose up to 250 degrees C, while PBI was stable up to 500 degrees C in an air atmosphere.
- Keywords
- adhesion strength; epoxy resin; copper; triazole; polybenzimidazole; Cu-azole complex; CORROSION INHIBITOR; BENZOTRIAZOLE
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/20758
- DOI
- 10.1163/156856198X00218
- ISSN
- 0169-4243
- Article Type
- Article
- Citation
- JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 12, no. 5, page. 541 - 561, 1998-01
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- There are no files associated with this item.
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