DC Field | Value | Language |
---|---|---|
dc.contributor.author | Son, JH | - |
dc.contributor.author | Song, YH | - |
dc.contributor.author | Kim, BJ | - |
dc.contributor.author | Lee, JL | - |
dc.date.accessioned | 2016-03-31T07:46:52Z | - |
dc.date.available | 2016-03-31T07:46:52Z | - |
dc.date.created | 2015-03-05 | - |
dc.date.issued | 2014-11 | - |
dc.identifier.issn | 1738-8090 | - |
dc.identifier.other | 2014-OAK-0000031315 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/14005 | - |
dc.description.abstract | We report on the enhanced thermal reliability of vertical-LEDs (V-LEDs) using novel reflective p-type ohmic contacts with good thermal stability. The reflective p-type ohmic contacts with Ni/Ag-Cu alloy multi-layer structure shows low contact resistivity, as low as 9.3 x 10(-6) Omega cm(2), and high reflectance of 86% after annealing at 450 degrees C. The V-LEDs with Ni/Ag-Cu alloy multi-layer structure show good thermal reliability with stress time at 300 degrees C in air ambient. The improved thermal stability of the reflective ohmic contacts to p-type GaN is believed to play a critical role in the thermal reliability of V-LEDs. | - |
dc.description.statementofresponsibility | X | - |
dc.language | English | - |
dc.publisher | KOREAN INST METALS MATERIALS | - |
dc.relation.isPartOf | ELECTRONIC MATERIALS LETTERS | - |
dc.subject | vertical light-emitting diodes | - |
dc.subject | reflective ohmic contact | - |
dc.subject | Ag agglomeration | - |
dc.subject | thermal stability | - |
dc.subject | LIGHT-EMITTING-DIODES | - |
dc.subject | LOW-RESISTANCE | - |
dc.subject | GAN | - |
dc.subject | AG | - |
dc.subject | STABILITY | - |
dc.subject | DESIGN | - |
dc.title | Effect of Reflective P-Type Ohmic Contact on Thermal Reliability of Vertical InGaN/GaN LEDs | - |
dc.type | Article | - |
dc.contributor.college | 신소재공학과 | - |
dc.identifier.doi | 10.1007/S13391-014-4127-1 | - |
dc.author.google | Son, JH | - |
dc.author.google | Song, YH | - |
dc.author.google | Kim, BJ | - |
dc.author.google | Lee, JL | - |
dc.relation.volume | 10 | - |
dc.relation.issue | 6 | - |
dc.relation.startpage | 1171 | - |
dc.relation.lastpage | 1174 | - |
dc.contributor.id | 10105416 | - |
dc.relation.journal | ELECTRONIC MATERIALS LETTERS | - |
dc.relation.index | SCI급, SCOPUS 등재논문 | - |
dc.relation.sci | SCIE | - |
dc.collections.name | Journal Papers | - |
dc.type.rims | ART | - |
dc.identifier.bibliographicCitation | ELECTRONIC MATERIALS LETTERS, v.10, no.6, pp.1171 - 1174 | - |
dc.identifier.wosid | 000344632600026 | - |
dc.date.tcdate | 2019-01-01 | - |
dc.citation.endPage | 1174 | - |
dc.citation.number | 6 | - |
dc.citation.startPage | 1171 | - |
dc.citation.title | ELECTRONIC MATERIALS LETTERS | - |
dc.citation.volume | 10 | - |
dc.contributor.affiliatedAuthor | Lee, JL | - |
dc.identifier.scopusid | 2-s2.0-84911473975 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
dc.description.wostc | 7 | - |
dc.description.scptc | 7 | * |
dc.date.scptcdate | 2018-05-121 | * |
dc.type.docType | Article | - |
dc.subject.keywordPlus | LIGHT-EMITTING-DIODES | - |
dc.subject.keywordPlus | LOW-RESISTANCE | - |
dc.subject.keywordPlus | GAN | - |
dc.subject.keywordPlus | AG | - |
dc.subject.keywordPlus | STABILITY | - |
dc.subject.keywordPlus | DESIGN | - |
dc.subject.keywordAuthor | vertical light-emitting diodes | - |
dc.subject.keywordAuthor | reflective ohmic contact | - |
dc.subject.keywordAuthor | Ag agglomeration | - |
dc.subject.keywordAuthor | thermal stability | - |
dc.relation.journalWebOfScienceCategory | Materials Science, Multidisciplinary | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.description.journalRegisteredClass | kci | - |
dc.relation.journalResearchArea | Materials Science | - |
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