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Microchamber/nanodimple polystyrene surfaces constructing cell aggregates fabricated by thermoset mold-based hot embossing SCIE SCOPUS

Title
Microchamber/nanodimple polystyrene surfaces constructing cell aggregates fabricated by thermoset mold-based hot embossing
Authors
Min Jin ChoiKyoung Je ChaKim, HWMoon-Hee NaBong-Kee LeeHwang, WKim, DS
Date Issued
2013-10
Publisher
ELSEVIER SCIENCE BV
Abstract
In this study, a thermoset mold-based hot embossing technique was evaluated for the laboratory-scale replication of thermoplastic surfaces with microchamber/nanodimple (MCND) structures, which enable to construct cell aggregates. Two different types of MCND polystyrene (PS) surfaces of an indented microlens/nanodimple PS surface and an indented micropyramid/nanodimple PS one were replicated by the present hot embossing technique as a proof-of-concept study. In the hot embossing process, two different polyurethane (PU) molds were fabricated from microindented nanodimple-anodic aluminum oxide templates through the UV molding process instead of manufacturing a metal mold. In order to optimize the processing condition of the PU mold-based hot embossing process, a parametric study was carried out based on the Taguchi method. Finally, the PS MCND surfaces replicated under the optimized hot embossing condition were applied to platforms for constructing cell aggregates. (C) 2013 Elsevier B.V. All rights reserved.
Keywords
Polyurethane mold; Hot embossing; Taguchi method; Polystyrene; Cell aggregates; Microchamber/nanodimple (MCND); Microindented nanodimple-anodic aluminum oxide (MNAAO)
URI
https://oasis.postech.ac.kr/handle/2014.oak/14538
DOI
10.1016/J.MEE.2013.02.049
ISSN
0167-9317
Article Type
Article
Citation
Microelectronic Engineering, vol. 110, page. 340 - 345, 2013-10
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황운봉HWANG, WOON BONG
Dept of Mechanical Enginrg
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