Article
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
고속 System-in-Package 인터커넥트 기술 동향
- Title
- 고속 System-in-Package 인터커넥트 기술 동향
- Authors
- 김병섭
- POSTECH Authors
- 김병섭
- Date Issued
- 2013-06
- Publisher
- IDEC
- Article Type
- Article
- Citation
- IDEC Newsletter, vol. 192, page. 10 - 13, 2013-06
- Files in This Item:
- There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.
Communities & Collection
Related Researcher
- 김병섭KIM, BYUNGSUB
- Dept of Electrical Enginrg