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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김병섭 | ko |
| dc.date.accessioned | 2017-07-19T09:13:16Z | - |
| dc.date.available | 2017-07-19T09:13:16Z | - |
| dc.date.created | 2014-03-24 | - |
| dc.date.issued | 2013-06 | - |
| dc.identifier.citation | IDEC Newsletter, v.192, pp.10 - 13 | - |
| dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/34631 | - |
| dc.language | Korean | - |
| dc.publisher | IDEC | - |
| dc.title | 고속 System-in-Package 인터커넥트 기술 동향 | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.contributor.localauthor | 김병섭 | - |
| dc.citation.endPage | 13 | - |
| dc.citation.startPage | 10 | - |
| dc.citation.title | IDEC Newsletter | - |
| dc.citation.volume | 192 | - |
| dc.description.journalClass | 3 | - |
| dc.type.docType | Article | - |
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- 김병섭KIM, BYUNGSUB
- Dept of Electrical Enginrg