고속 System-in-Package 인터커넥트 기술 동향
- Title
- 고속 System-in-Package 인터커넥트 기술 동향
- Authors
- 김병섭
- POSTECH Authors
- 김병섭
- Date Issued
- 2013-06
- Publisher
- IDEC
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/34631
- Article Type
- Article
- Citation
- IDEC Newsletter, vol. 192, page. 10 - 13, 2013-06
- Files in This Item:
- There are no files associated with this item.
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