Process-Induced Variations of 10-nm Node Bulk nFinFETs Considering Middle-of-Line Parasitics
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- Title
- Process-Induced Variations of 10-nm Node Bulk nFinFETs Considering Middle-of-Line Parasitics
- Authors
- Yoon, JS; Chang-Ki Baek; Baek, RH
- Date Issued
- 2016-09
- Publisher
- Institute of Electrical and Electronics Engineers
- Abstract
- Process-induced variations of 10-nm node n-type FinFETs considering middle-of-line parasitics were investigated in terms of dc/ac performances using fully calibrated TCAD simulations. Variations of positive fixed oxide charge density at shallow trench isolation interface and source/drain (S/D) height influenced off-state and on-state performance variations, respectively, but slightly on RC delay variations. Fin width variations induced off-state performance and RC delay variations critically due to the fluctuation of short channel effects. But, fin height variations affected them slightly due to the preserved gate-to-channel controllability and the buffered effects by varying drain currents and gate capacitances in the same direction. Gate length, spacer length, and S/D length variations influenced dc/ac performance variations severely; 2-nm-length changes were barely acceptable to satisfy 10% RC delay margin. Thus, the process-induced variability parameters, including fin width, gate length, spacer length, and S/D length, should be controlled tightly under a few nanometers to reduce dc/ac performance variations of the FinFETs.
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/37291
- DOI
- 10.1109/TED.2016.2586505
- ISSN
- 0018-9383
- Article Type
- Article
- Citation
- IEEE Transactions on Electron Devices, vol. 63, no. 9, page. 3399 - 3405, 2016-09
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