Full metadata record
DC Field | Value | Language |
dc.contributor.author | 박성진 | - |
dc.date.accessioned | 2018-05-22T15:58:32Z | - |
dc.date.available | 2018-05-22T15:58:32Z | - |
dc.date.created | 2010-05-03 | - |
dc.date.issued | 2000-09-20 | - |
dc.identifier.uri | https://oasis.postech.ac.kr/handle/2014.oak/45234 | - |
dc.publisher | JSPM | - |
dc.relation.isPartOf | 2000 PM World Congress | - |
dc.relation.isPartOf | PROCEEDINGS OF 2000 PM WORLD CONGRESS | - |
dc.title | Coupled CAE Analysis between Filling and Cooling Stages: Case Study for Powder Injection Molding: Electric Package | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.identifier.bibliographicCitation | 2000 PM World Congress | - |
dc.citation.title | 2000 PM World Congress | - |
dc.contributor.affiliatedAuthor | 박성진 | - |
dc.description.journalClass | 1 | - |
dc.description.journalClass | 1 | - |
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