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dc.contributor.author박성진-
dc.date.accessioned2018-05-22T15:58:32Z-
dc.date.available2018-05-22T15:58:32Z-
dc.date.created2010-05-03-
dc.date.issued2000-09-20-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/45234-
dc.publisherJSPM-
dc.relation.isPartOf2000 PM World Congress-
dc.relation.isPartOfPROCEEDINGS OF 2000 PM WORLD CONGRESS-
dc.titleCoupled CAE Analysis between Filling and Cooling Stages: Case Study for Powder Injection Molding: Electric Package-
dc.typeConference-
dc.type.rimsCONF-
dc.identifier.bibliographicCitation2000 PM World Congress-
dc.citation.title2000 PM World Congress-
dc.contributor.affiliatedAuthor박성진-
dc.description.journalClass1-
dc.description.journalClass1-

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박성진PARK, SEONG JIN
Dept of Mechanical Enginrg
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