Coupled CAE Analysis between Filling and Cooling Stages: Case Study for Powder Injection Molding: Electric Package
- Title
- Coupled CAE Analysis between Filling and Cooling Stages: Case Study for Powder Injection Molding: Electric Package
- Authors
- 박성진
- Date Issued
- 2000-09-20
- Publisher
- JSPM
- URI
- https://oasis.postech.ac.kr/handle/2014.oak/45234
- Article Type
- Conference
- Citation
- 2000 PM World Congress, 2000-09-20
- Files in This Item:
- There are no files associated with this item.
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