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A Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded SoC
- Title
- A Quantitative Analysis of Performance Benefits of 3D Die Stacking on Mobile and Embedded SoC
- Date Issued
- 2011-03-14
- Publisher
- European Design and Automation Association
- Article Type
- Conference
- Citation
- Design, Automation and Test in Europe, 2011-03-14
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Related Researcher
- 유승주YOO, SUNGJOO
- Dept of Electrical Enginrg