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dc.contributor.authorJeong, Jinsu-
dc.contributor.authorYoon, Jun-Sik-
dc.contributor.authorLee, Seunghwan-
dc.contributor.authorBAEK, ROCK HYUN-
dc.date.accessioned2019-07-16T02:10:15Z-
dc.date.available2019-07-16T02:10:15Z-
dc.date.created2019-07-12-
dc.date.issued2019-07-04-
dc.identifier.urihttps://oasis.postech.ac.kr/handle/2014.oak/99378-
dc.languageEnglish-
dc.publisherNANO KOREA-
dc.relation.isPartOfthe 17th International Nanotech Symposium & Exhibition-
dc.relation.isPartOfthe 17th International Nanotech Symposium & Exhibition-
dc.titleImpact of Thermo-Mechanical Stress Induced by Through-Silicon Vias on Performance Variations of 5-nm Node Si-Nanosheet FETs-
dc.typeConference-
dc.type.rimsCONF-
dc.identifier.bibliographicCitationthe 17th International Nanotech Symposium & Exhibition-
dc.citation.conferenceDate2019-07-03-
dc.citation.conferencePlaceKO-
dc.citation.conferencePlace경기도 고양시 킨텍스-
dc.citation.titlethe 17th International Nanotech Symposium & Exhibition-
dc.contributor.affiliatedAuthorJeong, Jinsu-
dc.contributor.affiliatedAuthorYoon, Jun-Sik-
dc.contributor.affiliatedAuthorLee, Seunghwan-
dc.contributor.affiliatedAuthorBAEK, ROCK HYUN-
dc.description.journalClass1-
dc.description.journalClass1-

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