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Impact of Thermo-Mechanical Stress Induced by Through-Silicon Vias on Performance Variations of 5-nm Node Si-Nanosheet FETs
- Title
- Impact of Thermo-Mechanical Stress Induced by Through-Silicon Vias on Performance Variations of 5-nm Node Si-Nanosheet FETs
- Date Issued
- 2019-07-04
- Publisher
- NANO KOREA
- Article Type
- Conference
- Citation
- the 17th International Nanotech Symposium & Exhibition, 2019-07-04
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Related Researcher
- 백록현BAEK, ROCK HYUN
- Dept of Electrical Enginrg