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PARK, CHAN EON(박찬언) orcid researcherid

Department: Dept. of Chemical Engineering(화학공학과)

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Publication & Time Cited Count (For the Last 5 years)

Results 221-240 of 280 (Search time: 0.002 seconds).

Article

Notch sensitivity of polycarbonate and toughened polycarbonateSCIESCOPUS

JOURNAL OF APPLIED POLYMER SCIENCE, vol. 89, no. 11, page. 3115 - 3121, 2003-09-12

Article

Investigation of crystallinity effects on the surface of oxygen plasma treated low density polyethylene using X-ray photoelectron spectroscopySCIESCOPUS

POLYMER, vol. 44, no. 20, page. 6287 - 6295, 2003-09

Article

Preparation of aqueous polyaniline dispersions by micellar-aided polymerizationSCIESCOPUS

JOURNAL OF APPLIED POLYMER SCIENCE, vol. 88, no. 6, page. 1550 - 1555, 2003-05-09

Article

Effects of reactive end-capper on mechanical properties of chemical amplified photosensitive polyimideSCIESCOPUS

POLYMER, vol. 44, no. 11, page. 3243 - 3249, 2003-05

Article

Switchable tack in side-chain liquid crystalline polymersSCIESCOPUS

MACROMOLECULES, vol. 36, no. 6, page. 2009 - 2014, 2003-03-25

Article

A closer look into the behavior of oxygen plasma-treated high-density polyethyleneSCIESCOPUS

POLYMER, vol. 44, no. 4, page. 1163 - 1170, 2003-02

Article

Real time exfoliation behavior of clay layers in epoxy-clay nanocompositesSCIESCOPUS

CHEMISTRY OF MATERIALS, vol. 15, no. 2, page. 419 - 424, 2003-01-28

Article

Surface modification of polysulfone ultrafiltration membrane by oxygen plasma treatmentSCIESCOPUS

JOURNAL OF MEMBRANE SCIENCE, vol. 199, no. 1-2, page. 135 - 145, 2002-04-30

Article

Improvement of wettability and reduction of aging effect by plasma treatment of low-density polyethylene with argon and oxygen mixturesSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 16, no. 5, page. 509 - 521, 2002-01

Article

Synthesis of polyimides containing triazole to improve their adhesion to copper substrateSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 16, no. 13, page. 1839 - 1851, 2002-01

Article

Inhibition of aging in plasma-treated high-density polyethyleneSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 16, no. 9, page. 1155 - 1169, 2002-01

Article

Soluble polyimides containing benzimidazole rings for interlevel dielectricsSCIESCOPUS

CHEMISTRY OF MATERIALS, vol. 13, no. 9, page. 2801 - 2806, 2001-09

Article

Adhesion strength of poly(imide-siloxane) with Alloy 42 lead frame and silicon dioxideSCIESCOPUS

POLYMER, vol. 42, no. 6, page. 2513 - 2520, 2001-03

Article

Effect of the physical and mechanical properties of epoxy resins on the adhesion behavior of epoxy/copper leadframe jointsSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 15, no. 4, page. 439 - 456, 2001-01

Article

Adhesion strength and mechanism of poly(imide-siloxane) to Alloy 42 leadframeSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 15, no. 8, page. 913 - 928, 2001-01

Article

Retardation of the surface rearrangement of O-2 plasma-treated LDPE by a two-step temperature controlSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 15, no. 14, page. 1805 - 1816, 2001-01

Article

Effects of molecular weight of polysulfone on phase separation behavior for cyanate ester/polysulfone blendsSCIESCOPUS

JOURNAL OF APPLIED POLYMER SCIENCE, vol. 77, no. 4, page. 921 - 927, 2000-07-25

Article

The aging effects of repeated oxygen plasma treatment on the surface rearrangement and adhesion of LDPE to aluminumSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 14, no. 8, page. 1071 - 1083, 2000-01

Article

Investigation of the surface rearrangement of poly(imide-siloxane) using dynamic contact angle measurementsSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 14, no. 1, page. 107 - 121, 2000-01

Article

Effects of the lamination temperature on the properties of poly(ethylene terephthalate-co-isophthalate) in polyester-laminated tin-free steel can - II. Adhesion mechanism of poly(ethylene terephthalate-co-isophthalate) to TFSSCIESCOPUS

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, vol. 14, no. 9, page. 1145 - 1157, 2000-01

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