IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, vol. 60, no. 2, page. 91 - 95, 2013-02
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, vol. 59, no. 11, page. 721 - 725, 2012-11
IEEE Journal of Solid-State Circuits, vol. 47, no. 9, page. 2068 - 2079, 2012-09
IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 47, no. 4, page. 875 - 883, 2012-04
IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 47, no. 3, page. 736 - 743, 2012-03
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, vol. 58, no. 10, page. 687 - 691, 2011-10
IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 46, no. 9, page. 2053 - 2063, 2011-09
Journal of Electrical and Computer Engineering, 2011-08
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, vol. 58, no. 5, page. 269 - 273, 2011-05
IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 46, no. 3, page. 651 - 659, 2011-03
IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 46, no. 2, page. 435 - 444, 2011-02
IEICE TRANSACTIONS ON ELECTRONICS, vol. E93C, no. 12, page. 1662 - 1669, 2010-12
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, vol. 10, no. 4, page. 309 - 315, 2010-12
IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 45, no. 12, page. 2874 - 2881, 2010-12
JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, vol. 10, no. 3, page. 232 - 239, 2010-09
IEICE TRANSACTIONS ON ELECTRONICS, vol. E93C, no. 8, page. 1333 - 1337, 2010-08
IEEE TRANSACTIONS ON ADVANCED PACKAGING, vol. 33, no. 2, page. 552 - 558, 2010-05
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, vol. 57, no. 5, page. 379 - 383, 2010-05
IEICE TRANSACTIONS ON ELECTRONICS, vol. E93C, no. 1, page. 132 - 135, 2010-01
IEEE JOURNAL OF SOLID-STATE CIRCUITS, vol. 44, no. 11, page. 2891 - 2900, 2009-11